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Education

Sijil Pelajaran Malaysia (SPM)

Tunku Kurshiah College

BSc Nuclear Sciences

Universiti Kebangsaan Malaysia (UKM)

2nd Class Upper , Major in Nuclear Sciences

Sep 1995Present

Master of Science

University of Surrey , England

Published a thesis on adhesion bonding characeristics on ceramics using CIBA GEIGY special adhesive

ESCA and SEM was used as major analytical tools during the study

Work experience

Jan 2010Present

Lecturer

Universiti Malaysia Pahang
  • Lecturer in Engineering Materials for Semester 1 Sesi Akademik 2010/2011 , Batch 2010/2014
Jan 2007Apr 2009

Senior Staff Engineer

Qimonda Semiconductor
  • Responsible in Qimonda Back End Technology (R&D) transfer from Dresden,Germany to Malacca,Malaysia in terms of facilitating the R&D corridor infrastructure at manufacturing site
  • Key player in Senai Global Module House Transfer Project
  • Project manager for New Product Qualifications & Ramp-up to manufacturing line
  • Technical speaker for Qimonda BET Malacca in Global R&D workshops and conferences
  • Section manager for Module Integration & Modules group
  • Mentor for new project managers for Technology Integration Department
  • Manage Senai Global Module House Transfer Project Teams
  • Company representative for UTM-Qimonda R&D projects 
Jan 2006Dec 2007

Staff Engineer

Qimonda Semiconductor
  • Key player in Qimonda Supply Chain Network Optimisation Project (Porto to Malacca)
  • Project manager for Back End Porto to Back End Malacca product transfer qualifications
  • Manage a Material Engineering Team which support product enabling projects in Technology Department
Jan 2004Dec 2005

Senior Technology Engineer

Infineon Technologies Malaysia
  • Project manager for new material qualifications
  • Key player in Supplier Partnership Programs & Supplier Improvement Programs Technical speaker for Memory Production in Global Material Synergy Workshops
  • Key player in Supplier Audit Teams Section manager for Material Technology Integration
Jan 1999Dec 2003

Technology Engineer

Infineon Technologies Malaysia
  • Product Project manager for IC Package and Memory Module Back End product transfer qualifications in Malacca from various Infineon development sites.
  • Leader in qualifications of new package technology with variation of different wafer fabrication site and different package manufacturing site within Infineon Technologies Memory worldwide.
  • Technical Project manager for material transfer qualifications from central R&D site which was located in Dresden. Responsible in conducting manufacturability tests upon prototyping phase in central R&D and leader in New Product Introduction teams. Heavily involved in supplier related problem solutions, material  specifications and driving process improvements upon ramp-up phases.
  • Special knowledge obtained in mold compound manufacturing process by having opportunity to visit established manufacturing plant in Japan including Hitachi Chemical, Sumitomo and Toshiba & Shin Etsu
  • Participated in material audit team in Hitachi Chemical Plant
  • Attended material training at supplier's site and well exposed to the inspection tools for outgoing quality control at supplier's side for mold compound
  • Experienced in solder paste qualification during the 'Infineon goes green' phases. Able to drive material improvement plus process optimisation during ramp-up phase upon highlighted manufacturing issues from manufacturing site.   
Jan 1996Dec 1998

Development Engineer

SIEMENS SEMICONDUCTOR MALAYSIA
  • Project Leader for new package introduction from R&D site in Regensburg, Germany to Back End manufacturing Line in Malaysia. Core task involving running qualification projects with cross-functional teams in manufacturing site with technical specification conformance to R&D centre in Germany.
  • Leader in task force to solve manufacturing related problems in ramp-up phase.
  • Lead technical discussions with supplier in supplier partnership programs and process improvement programs.

Skills

Presentation Skill
Leadership
Six Sigma Training
Participated in Six Sigma Training (Black Belt Level)

References

Dato' Dr Syed Ahmad Syed Samsuddin Al Saggof

Azman Jaafar

Professor Madya Dr Wan Azhar Wan Yusof

Portfolio

Faculty establishment

1. Setting-up team concept for organising faculty events

Pending: Checklist and templates for events

2. Establish a central documentation (soft-copy) for Faculty Course Structure and Course Flow

3. Create SOPs for FKP's 5S certification preparation

Teaching Portfolio

1. Set-up a social network channel for students in facebook as subject's official newsroom

2. Attended P&P courses in Dec 2010

UMP Appointments

1. Head of Manufacturing Programme in Faculty of Manufacturing Engineering, UMP Jan 2010

2. AJK ISO

3. AJK inovasi

Courses attended

Dec 11-13th A Short Course in Genetic Algorithm by Prod Mitsuo  Gen

Patent

EUROPEAN PATENT APPLICATION

A lead frame for electronic semi-conductor devices

EP 0 923 129 A1