Siew Eng Quah


A technical staff-cum-manager with extensive experience in computer-aided engineering (CAE) tools, experimental stress analysis, instrumented shock/vibration testing, integration of CAE tools to improve product development efficiency, providing leadership in technology development projects leading to improvement in product development efficiency. Extensive mentorship and training experience with junior engineering staffs and undergraduate/postgraduate students undertaking Motorola-sponsored projects. Reported directly to the Director of Engineering in the Motorola Mobile Devices head office in USA. Currently holding a part-time lecturer appointment in a Polytechnic.

Key Areas of Expertise


oExtensive hand-on experience with the following engineering tools: Pro/E, ABAQUS, LS-DYNA, PAM-CRASH, PATRAN, Moldflow and Hyperwork suite of products, MATHLAB

oProgramming languages: ‘C’, FORTRAN, BASIC

oExperimental stress analysis

oInstrumented shock/vibration testing

oProduct development process


oProviding technical leadership, resource planning and project management roles in technology/product development projects

oSetting up of technical team including staff selection and mentoring


oDeveloping training materials and conducting training in structural analysis, instrumented shock/vibration testing, experimental stress analysis

oSupervising of students’ academic projects

Work History

Work History
Jan 1994 - Feb 2009

Distinguished Member of the Technical Staff (R&D)


Reported to the director of engineering for Simulation and Mechanical Technology Group in the Mobile Devices headquarter in the US. Lead a team of 5 engineers in Singapore Design Centre providing CAE analysis support, experimental stress analysis and instrumented shock/vibration testing for product development teams in Singapore as well as the Asia region.

·Reviewed new cellular phone designs from design sites in the Asia region and recommended improvements to these designs, particularly those pertaining to the mechanical reliability.

·Supported product development teams in CAE, experimental stress analysis and instrumented shock/vibration testing and other lab supports.

·Integrated and implemented CAE tools in product development process to help understand the root causes of the mechanical problems, evaluate/optimize designs with reduced rounds of prototype testing, thus improving development cycle-time and product quality.

·Mentored CAE (Computer-Aided Engineering) engineers in the cellular phone designing centres in the Asia Pacific region, enabling them to conduct static and dynamic structural analysis on cellular phone designs to improve the product reliability and minimize the number of rounds of prototype testing.

·Collaborated with local institutions on projects leading to improvement of product development efficiency and CAE tools capabilities.

·Worked with the technical team in the US headquarters to define improvement in tools/methodology in product development process so as to improve design efficiency.

Major Accomplishments

·1996: Completed the collaboration project with the National University of Singapore (NUS) to establish a methodology to model the structural behaviour of assembled electronic products under drop loading. This process was applied to all products developed out of Motorola Singapore Design Centre starting 1996.

·1998: Chaired the mechanical knowledge sharing committee in Motorola Singapore Design Centre as initiated by the director of the Singapore Design Centre. The end result was the documentation of key design guidelines/considerations of various component selections and designs. These documents were the essential resource for newly hired engineers.

·1998-2008: Developed training materials and conducted training on application of CAE tools in product development to the product design engineers. Actual application examples were continuously updated in the training materials. More than 20 engineers were trained in Motorola Singapore Design Centre.

·1998-2008: Participated and contributed to mechanical design review and mechanical failure resolution of more than 40 cellular phone and pager designs in the Asia region.

·1999: Led the effort to successfully establish the application of Acoustic and Moldflow analysis tools to cellular phone design process in Motorola Singapore Design Centre.

·2002: Was inducted to a technical board within the company in 2002 for contribution to the successful integration and implementation of CAE tools to product development flow; the total number of members in this technical board constitute only 2% of the entire engineering population in the company worldwide. Only a total of 5 staffs (including myself) from Singapore site were in the technical board.

·2004-2006: Selected and trained the CAE engineers in the key design sites in Asia; i.e. Beijing, Seoul and Taipei. A total of 8 CAE engineers from Beijing, Seoul and Taipei were trained during this period.

·2005: Developed and introduced data mining tools for reliability database to help product designers search for past components/suppliers/process-related problems efficiently, thus improving the design cycle-time.

·2008: Led and successfully implemented a web-based material database system which is being used by the CAE and product development engineers within the company. It helped to maintain the list of materials and the essential properties systematically. At the same time, it enabled the engineers to access the essential material data required in the design process conveniently.


Jul 1991 - Dec 1993


National University of Singapore

·Research project title: ‘Impact Stress Waves Propagation in Curved and Periodic Structures’

·Developed numerical scheme for solving a system of partial differential equations

·Conducted laboratory classes for undergraduates; graded the laboratory reports

·Mentored 3 undergraduate students on usage of DYNA2D finite element software for their final year project work

Jul 1987 - Jun 1991

B.Eng. (Hons)

Research Project: Finite Element Analysis of Stress Waves Propogations in a Composite Plate