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Work experience

Oct 2014Present

Manufacturing Engineer

  •  Coordinate the internal teams for ISIR submission as per target to achieve KPI (Handheld Project).
  • Verify parts and/or materials are compliant to all requirements and specifications.
  • Responsible to submit ISIR documents and sample to customer (DYSON).
  • Collect the approved sample and documents from customer (DYSON).
  • Communicate with SBM team for ISIR submission for bought out parts from supplier.
  • Update the master list of ISIR submission for every part submission.
  • Verify BOM with CN/CR for any changes in ISIR submission.
  • Ensure ISIR approval status for all the parts which use for production line.
Nov 2013Oct 2014

Maintenance Engineer

Heimann Sensor Packaging
  • Ensure that the production line run without any problem.
  • Track machine down time, analyze the problems & action plan to reduce the downtime.
  • Troubleshoot machine issues.
  •  PM method and plan for all machines (weekly, monthly, and yearly)
  •  Arrange overtime schedule for technicians.
  •  Communicate with vendors/supplier to purchase spare parts/tools.
  •  Spare parts/tools tracking.
  •  Improve UPH and reduce cycle time.
Oct 2011Nov 2013

Process Development Engineer

Heimann Sensor Packaging
  • Improve process, quality and yield by conducting improvement projects.
  • Involve in NPI for HTPA 8x8, HTPA 16x4, HTPA 16x16, HTPA 32x31 and HTPA 64X62 Xenon projects (Assembly level) and improve the quality.
  • Generate Control Plan and FMEA for new products.
  • Communicate with vendors and suppliers for tool/jig improvement.
  • SOP development to ensure that employees are learning new skills to improve their performance.
  • Developing solution to production problems and tool modification.
  • Monitoring Production Line (from Wafer Dicing process until finish good parts)
  • Able to hands on machines: ADT 7200(wafer Dicing), K&S 7500(wafer Dicing), Delvotec(wire bonding),  ASM 559(wire bond), ALPHA & MIYACHI Sealer (sealer machines).


Jul 2017Sep 2011

Bachelor of Degree in Microlectronics Engineering

Universiti Malaysia Perlis