Advanced Tech. Development -- Process Integration Engineer
United Microelectronics Corporation (UMC), Tainan, Taiwan
- A+ in 2014 & 2015 annual performance appraisals.
- Develop advanced 28nm HKMG platform, focus on layout dependence effect(LDE) and Ion uniformity(IDU) improvement.
- Handle quarterly 28nm HKMG shuttle tape-out for customer's early IP/product verification, customer including Marvell, Faraday, MaxLinear and Renesas. Successfully drove MaxLinear's product for mass production in 2015 Q1.
- Coordinated Broadcom 28nm HKMG MPW tape-out, including customer's test chips and model testkey. Successfully transferred to fab for risk production in 2015 Q4.
- Established solid tape-out working flow to achieve zero excursion.