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Summary

More than 3 years of experience as a technical assistant at Wroclaw University of Technology, including wide range of duties such as: electronics and LTCC structures design, C++ microcontroller programming, research, publications preparation and industry cooperation. Board technical education background focused on new technologies in the field of electronics, microsystems, photonics and programming. Fast learning and problem-solving skills. Published author of articles. Focused on learning and improving his skills.

Work History

Dec 2012Present

Technical Assistant

Wroclaw University of Technology

Major duties: LTCC structures design and manufacturing, PCB design and manufacturing (digital and analogue circuits), C++ microcontroller programming, research and publications, multiphysics simulations 

Jul 2012Sep 2012

Trainee

Wroclaw University of Technology

Trainee student at Thick Films Micro-systems Laboratory. Major duties:  electronics design, LTCC structures design and manufacturing

Aug 2011Aug 2011

Trainee

Wroclaw University of Technology

Trainee student at Thick Films Micro-systems Laboratory. Major duties:  electronics design, LTCC structures design and manufacturing

Education

20122013

Master of Science

Wroclaw University of Technology

Department of Microsystems Electronics and Photonics, Electronics and Telecommunication, study in english

20082012

Engeener

Wroclaw University of Technology

Department of Microsystems Electronics and Photonics, Electronics and Telecommunication

20052008

High School , Strzelin

Extended profile in mathematics, informatics and English




Conferences and Papers

Conferences:

  • Dorczyński, D. Jurków, L. Golonka, Investigation of conductive via properties using Design of the Experiment methodology, Proceedings of 37th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 22-25 September 2013, Kraków, Poland
  • Dorczyński, J. Szarycz, L. Golonka, Influence of Thermal Vias on Temperature Distribution in LTCC Microreactor Structure, Proceedings of 39th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 20-23 September 2015, Gdańsk, Poland
  • P. Rydygier, M. Baszyński, M. Czok, A. Dąbrowski, M. Dorczyński, H. Roguszczak, L. Golonka, 1 Watt LTCC DC/DC Converter with 6 kV isolation transformer, Proceedings of 39th International Microelectronics and Packaging IMAPS-CPMT Poland Conference : 20-23 September 2015, Gdańsk, Poland

Papers:

  • Dorczyński, D. Jurków, The Comparison of Sheet Resistance of Screen- and Stencil- Printed Resistors, International Jurnal of Applied Ceramic Technology, Volume 12, Issue Supplement S1, pages E106-E111, January/February 2015
  • Dorczyński, D. Jurków, L. Golonka, The Investigation of Conductive Via Properties , Methrology and Measurement Systems, Volume 22, Issue 1, Pages 39-50, February 2015
  • Jurków, J. Stiernstedt, M. Dorczyński, G. Wetter, Investigation of High Temperature Co-fired Ceramic Tapes Lamination Conditions, Ceramics International, Volume 41, Issue 6, pages 7860-7871, July 2015


Certifications

Feb 2015Present

Altium Designer software

Computer Controls, Bielsko-Biala

Basic level

Nov 2015Present

COMSOL Multiphysics software

COMSOL, Warsaw

Basic level

Important Projects

  • TACMON 2, development of a very low-cost Interactive Graphical Tactile Display for the visually impaired, http://www.tacmon.eu/new, duties: LTCC chips manufacturing, concept work
  • Temperature controller for isostatic lamination machine, duties: concept work, PID algorithm implementation, design and manufacturing of electronics and housing
  • Integrated 1 W DC-DC transformer with breakdown voltage insulation at 6 kV using LTCC technology, duties: concept work, design and chip manufacturing
  • Digital signals insulator with breakdown voltage insulation at 8 kV using LTCC technology, duties: concept work, design and chip manufacturing

Interests and Hobbies

canoeing, snowboarding,  nature


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