James Boster

Work History

Work History
Mar 2000 - Present

Senior Mechanical Engineer

Lam Research

·Responsible for Management of Intel’s Copy Exactly! Process for SOLA & Vector PECVD Systems

·Provide primary Configuration and Engineering Management for Intel Vector tool deliveries;

    o$40 Million dollars in tool shipments, on average, per year

·Manage Product BoM Structures, Customer Specials,& Spare Part Lists through Lam ECO processes

    oResponsible for Releasing and Maintaining the Vector Configuration BoMs for the 1266/68/70 Intel technologies, utilizing Pro/E, Pro/IntraLink & WindChill Product Lifecycle Management S/W

·Coordinate Initial Intel Re-use tool upgrade processes by providing the CE! tool audit forms, audit analysis,        conversion BoM development and Retrofit Kit ECO releases

    o$10+ Million dollars in Conversion Kit shipments, on average, per Intel technology node

Project Engineer – PECVD Business UnitJune 2001 – June 2004

·Supported Continuous Improvement Projects for Vector & C2 Sequel (200mm) PECVD Products

·Provided Support for Field Service, Logistics, and Manufacturing Processes

·Managed Technical and Change Details for Exhaust Management Sub-Suppliers (Edwards & Ecosys)

·Coordinated Initial Sub-Fab Facilities Integration for Fab Tools in new Application Lab Facility

Value Engineer – New Product DevelopmentMarch 2000 –June 2001

·New Product Introduction Team Member for Highly Successful 300mm “VECTOR” PECVD System

·Provided Value Engineering guidance for component design and Value Addition Outsourced Assembly Configuration determinations.

Nov 1997 - Mar 2000

MANUFACTURING/DESIGN ENGINEER

MOORE TECHNOLOGIES

·     Responsible for the Technology Transfer, Manufacturing Production, and Sustaining Engineering of Applied Materials 7700 Semiconductor Production Capital Equipment

·    Configured Manufacturing Facilities Floor for Efficient Material and Production Flowfor Sub-assembly Build, Assembly Integration, and Final Assembly following AMAT Lean ManufacturingMethodologies

·Designed Improved & Cost Reduced Mechanical Assemblies for Next Generation MT 7700 Process System Utilizing Pro/E CAD Software. Cost Reduced Assemblies by as much as 25%

May 1996 - Nov 1997

QUALITY MANAGER / MANUFACTURING ENGINEER

Smart Machines

·Oversaw Quality Issues Pertaining to Design Changes, Design Reviews, Corrective Actions, Material Quality, and Vendor Selection & Certification for Robotic Equipment Manufacturing

·Developed Customer Service Systems (Field Service, Spares, Documentation & Training, etc.) Following ISO 9000 Guidelines

·Worked with IE Consultants to Determine Resource Requirements and Factory Floor Layout for a Mixed Model, Integrate To Order, Assembly Line.

Jul 1995 - May 1996

R&D MANUFACTURING ENGINEER

VARIAN THIN FILM SYSTEMS

·Transitioned PVD Source Product Development From Design, Pre-Production, to Production

·Developed Manufacturing Process Control Procedures, Determined Cost Effective Production Part and Manufacturing Processes

·Coordinated Sub-Supplier Process Development (Dissimilar Metal Bonding, High Speed CNC Routing, Thermoset Plastic Compression Molding, &  Vacuum Casting) for New Product components

·Utilized Quick-turn Prototyping for Development of Optimal Source Magnetron.

Feb 1995 - Jul 1995

MANUFACTURING ENGINEER

APPLIED MATERIALS

New Product Development – May - July

·Supported New Product Release of the Centura 5200 Silicon Etch Process System

·Coordinated Process Module to Wafer Handler Interface Integration between Local Module Engineering Team and Mid-West Handler Engineering Team

Legacy Product Continuous Improvement – Feb - May

·Performed Sustaining Engineering activities for Legacy Hexode 8300 Batch Etch Process System

·Improved Electro-Mechanical Sub-Assembly Efficiency by Developing Dedicated Work Cells

·Managed OEM Component Obsolescence and Replacement Component Implementation

Mar 1993 - Aug 1994

MANUFACTURING ENGINEER

Hine Design

·Responsible for Manufacturing Engineering activities related to Assembly and Testing of Semiconductor Wafer Handling Automation Equipment

·Increased Production Through-put 30% by initiating World Class Production methods; Cellular Manufacturing and Drum-Buffer-Rope Optimization

·Decreased Part Scrap rate by 40% and WIP Inventories 25% through Improved Material Handling Methods, Reduced Material Movement, and Visual WIP Inventory Control

Education

Education