Process Control Engineer
STMICROELECTRONICS PTE LTD, SINGAPORE
Responsible for achieving improvement of the Defectivity index (Electrical yield/ Defect density) of the fabrication unit by establishing and maintaining control on production wafers, equipments and the cleanroom environment.
o Continuously engaged in improvement activities for wafer electrical yield through team coordination, systematic problem solving, statistical analysis, procedural improvement, documentation and training
o Ownership of Defectivity metrology tools like KLA Tencor 7700 Darkfield inspection tool & Surfscan 6420; hands on experience in recipe creation, tool set-up and calibration
o Compiled an engineer’s handbook covering the major concepts of defectivity and its control in cleanroom, to be used as training material for new engineers
o Demonstrated quick grasp of each area and was given responsibility of handling multiple production lines (5” and 6” wafers), involving numerous device families (BJT, CMOS, MOS, IPAD) in the space of one and half years.
Promoted with additional responsibility to use knowledge in fabrication processes as well as overall fab system in dealing with different failure modes leading to wafers scrapped in the production line.
o Responsible to improve the wafer fabyield (loss/output) index of the 5” wafer production line involving 3 different fabs and 10 different technological product families running hundreds of different devices.
o Lead and drive teams of process, equipment and device engineers and resolve issues of varying origins and symptoms – from system robustness and people management to device functional test failures due to process and equipment problems
o Used quality control Six Sigma tools like Design of Experiments, Failure Mode and Effects Analysis, Statistical Process Control, 8D and Pareto charts to prevent and troubleshoot problems with process, device and equipment.